Optical apparatus

ABSTRACT

An optical apparatus includes: an optical component opposed to and spaced apart from a light-emitting surface through which laser light is emitted; a case that houses a semiconductor laser element and the optical component and includes an introduction port for introducing gas and an exhaust port for exhausting the gas; and a flow passage section (i.e., a tubular body) including a spray port for spraying the semiconductor laser element with the gas introduced from the introduction port.

CROSS-REFERENCE OF RELATED APPLICATIONS

This application is the U.S. National Phase under 35 U.S.C. § 371 ofInternational Patent Application No. PCT/JP2019/035127, filed on Sep. 6,2019, which in turn claims the benefit of Japanese Patent ApplicationNo. 2018-171093, dated Sep. 13, 2018, the entire disclosures of whichApplications are incorporated by reference herein.

TECHNICAL FIELD

The present disclosure relates to an optical apparatus including asemiconductor laser element.

Note that the present disclosure is filed as a patent applicationaccording to the research named “Development of Advanced LaserProcessing with Intelligence based on High-Brightness andHigh-Efficiency Laser Technologies/Development on Gan-Based High-PowerHigh-Beam Quality Semiconductor Lasers for Highly-Efficient LaserProcessing” commissioned in 2016 of New Energy and Industrial TechnologyDevelopment Organization (NEDO) under Article 17 of IndustrialTechnology Enhancement Act.

BACKGROUND ART

Using laser light, laser processing allows non-contact and fineprocessing as compared to background art. In particular, direct diodelasers using a semiconductor laser element as a light source do notconvert laser light and are thus highly efficient. However,semiconductor laser elements have outputs of several watts per emitter(i.e., light-emitter). On the other hand, laser light used forprocessing needs to have optical output ranging from hundreds of wattsto several kilowatts. Thus, if laser light is used for processing,semiconductor laser elements employ an array structure including a largenumber of aligned emitters, for example. A semiconductor laser elementwith a multi-emitter structure synthesizes laser light output fromemitters to obtain high-output laser light.

For example, in an optical apparatus using a gallium nitride (GaN)-basedsemiconductor laser element, low-molecular-weight siloxane present in apackage that houses the GaN-based semiconductor laser element reactswith laser light to adhere onto the facet of the semiconductor laserelement, which degrades the laser characteristics. Tl address theproblem, the inside of the package of a GaN-based semiconductor laserelement is sealed airtight to reduce unclearness of the facet of thesemiconductor laser element.

However, the sizes of semiconductor laser elements with a multi-emitterstructure are as 80 times the sizes of semiconductor laser elements witha single emitter structure. It takes cost to seal the formersemiconductor laser elements as a whole airtight. To address theproblem, disclosed (see e.g., Patent Literature (PTL 1) is a techniqueof reducing adhesion of dust or dirt onto the facet of a semiconductorlaser element by the gas flowing inside the package that houses asemiconductor laser element.

CITATION LIST Patent Literature

-   PTL 1: Japanese Unexamined Patent Application Publication No.    2002-144073

SUMMARY OF THE INVENTION Technical Problems

It is however difficult in the technique disclosed in PTL 1 to cause gasto flow near the light-emitting surface of a semiconductor laserelement, if an optical component such as a lens is opposed to thelight-emitting surface of the semiconductor laser element at a distanceof about 30 μm to about 200 μm. In addition, near the light-emittingsurface of the semiconductor laser element, the gas remains and dust ordirt tends to be collected.

The present disclosure provides an optical apparatus capable of reducingadhesion of dust or dirt onto the facet of a semiconductor laserelement.

Solution to Problem

An optical apparatus according to an aspect of the present disclosureincludes: a semiconductor laser element that emits laser light; anoptical component opposed to and spaced apart from a light-emittingsurface through which the laser light is emitted; a case that houses thesemiconductor laser element and the optical component, and includes anintroduction port for introducing gas and an exhaust port for exhaustingthe gas; and a flow passage section including a spray port for sprayingthe semiconductor laser element with the gas introduced from theintroduction port.

Advantageous Effect of Invention

The optical apparatus according to the present disclosure reducesadhesion of dust or dirt onto the facet of a semiconductor laserelement.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1A is a top view showing an internal configuration of an opticalapparatus according to Embodiment 1.

FIG. 1B is a side view showing the internal configuration of the opticalapparatus according to Embodiment 1.

FIG. 1C is a partial side view showing the optical apparatus accordingto Embodiment 1.

FIG. 1D is a partial front view showing the optical apparatus accordingto Embodiment 1.

FIG. 2 is a graph showing a change in the optical characteristics of theoptical apparatus according to Embodiment 1.

FIG. 3A is a partial side view showing an optical apparatus according toVariation 1 of Embodiment 1.

FIG. 3B is a partial front view showing the optical apparatus accordingto Variation 1 of Embodiment 1.

FIG. 4A is a partial side view showing an optical apparatus according toVariation 2 of Embodiment 1.

FIG. 4B is a partial front view showing the optical apparatus accordingto Variation 2 of Embodiment 1.

FIG. 5A is a partial side view showing an optical apparatus according toVariation 3 of Embodiment 1.

FIG. 5B is a partial front view showing the optical apparatus accordingto Variation 3 of Embodiment 1.

FIG. 6 is a top view showing an internal configuration of an opticalapparatus according to Variation 4 of Embodiment 1.

FIG. 7 is a top view showing an internal configuration of an opticalapparatus according to Variation 5 of Embodiment 1.

FIG. 8 is a top view showing an internal configuration of an opticalapparatus according to Embodiment 2.

FIG. 9 is a partial top view showing an internal configuration of anoptical apparatus according to a variation of Embodiment 2.

FIG. 10 is a partial top view showing an internal configuration of anoptical apparatus according to Embodiment 3.

FIG. 11A is a partial side view showing an optical apparatus accordingto Embodiment 4.

FIG. 11B is a partial perspective view showing the optical apparatusaccording to Embodiment 4.

FIG. 12A is a partial side view showing an optical apparatus accordingto Variation 1 of Embodiment 4.

FIG. 12B is a partial perspective view showing the optical apparatusaccording to Variation 1 of Embodiment 4.

FIG. 13A is a partial side view showing an optical apparatus accordingto Variation 2 of Embodiment 4.

FIG. 13B is a partial perspective view showing the optical apparatusaccording to Variation 2 of Embodiment 4.

FIG. 14A is a partial side view showing an optical apparatus accordingto Variation 3 of Embodiment 4.

FIG. 14B is a partial perspective view showing the optical apparatusaccording to Variation 3 of Embodiment 4.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Now, embodiments of the present disclosure will be described in detailwith reference to the drawings. Note that the embodiments describedbelow are mere specific examples of the present disclosure. Thenumerical values, shapes, materials, constituent elements, thearrangement and connection of the constituent elements, steps, steporders etc. shown in the following embodiments are thus mere examples,and are not intended to limit the scope of the present disclosure. Thepresent disclosure is limited only by the claims.

Among the constituent elements in the following embodiments, those notrecited in any of the independent claims defining the broadest conceptof the present disclosure will be described.

The figures are schematic representations and not necessarily drawnstrictly to scale. Redundant descriptions of substantially the sameconstituent elements may be omitted.

In the specification and drawings, the X-, Y-, and Z-axes correspond tothree axes of the three-dimensional orthogonal coordinate system. In theembodiments, the positive side of the Z-axis is located above, whereasthe negative side of the Z-axis is located below. In this specification,the “thickness direction” means the direction in which the thickness ofeach optical apparatus extends, and which is perpendicular to the“mounting surface” of each case on which a semiconductor laser elementis mounted. A “plan view” is seen in the direction perpendicular to themounting surface. A “front view” is a view when the light-emittingsurface of each semiconductor laser element is viewed in the directionperpendicular to the light-emitting surface.

In the drawings, the flow of gas is schematically indicated by brokenarrows.

In this specification, the terms “upper” and “lower” do not mean“upward” (upper in the vertical direction) and “downward” (lower in thevertical direction) in the absolute spatial recognition. The terms“upper” and “lower” are applicable not only where two constituentelements are spaced apart from each other with another constituentelement interposed therebetween but also where two constituent elementsare close to each other and in contact with each other.

In this specification, the terms such as “parallel” indicating thepositional relationships and such as “cuboid” indicating the shapes etc.include not only completely “parallel” or “perfect cuboid” but alsoinclude manufacturing errors. For example, the term “parallel” means“substantially parallel” including manufacturing errors. For example,the term “cuboid” means “substantial cuboid” including manufacturingerrors.

Embodiment 1

Configuration

FIG. 1A is a top view showing an internal configuration of opticalapparatus 100 according to Embodiment 1. FIG. 1B is a side view showingthe internal configuration of optical apparatus 100 according toEmbodiment 1. FIG. 1C is a partial side view showing optical apparatus100 according to Embodiment 1. FIG. 1D is a partial front view showingoptical apparatus 100 according to Embodiment 1. Note that FIGS. 1C and1D show only some of the constituent elements of optical apparatus 100.

Optical apparatus 100 is a laser module that emits laser light 210.Optical apparatus 100 is used as a laser source for a processing devicefor laser processing, for example. In this embodiment, optical apparatus100 is what is called a “CAN package” laser diode module.

Optical apparatus 100 includes optical device 220, optical component130, case 140, flow passage section (i.e., tubular body) 150, and gassupply device 190.

Optical device 220 emits laser light 210. Specifically, optical device220 includes semiconductor laser element 110, submount substrate 120,and support members 160 and 161.

Semiconductor laser element 110 is a semiconductor element that emitslaser light 210. Semiconductor laser element 110 emits from blue lightto ultraviolet light with a wavelength ranging from about 350 nm toabout 450 nm, for example. Semiconductor laser element 110 may be asingle emitter laser diode with a single luminous point or may be amulti-emitter laser diode with a plurality of luminous points.Semiconductor laser element 110 is made of GaN-based or InGaN-basedsemiconductor, for example.

Mounted on submount substrate 120 is semiconductor laser element 110.The material employed for submount substrate 120 is not particularlylimited but is a metal material such as CuW or a ceramic material suchas AlN, for example.

Support members 160 and 161 support, in case 140, semiconductor laserelement 110 mounted on submount substrate 120. Support members 160 and161 are arranged in case 140 to sandwich semiconductor laser element 110mounted on submount substrate 120 from above and below. The materialemployed for support members 160 and 161 is not particularly limited butis a metal material such as Cu, for example. Note that support members160 and 161 may be made of a material with a high thermal conductivity.This material easily releases the heat generated in semiconductor laserelement 110 into case 140.

Submount substrate 120 and support members 160 and 161 may have metalwires electrically connected to semiconductor laser element 110. Forexample, electric power is supplied to semiconductor laser element 110via the metal wires and wires (not shown) in case 140.

Optical component 130 controls the distribution of laser light 210emitted by semiconductor laser element 110 and transmits the controlledlight. Optical component 130 is, in case 140, opposed to and spacedapart from light-emitting surface 111 of semiconductor laser element110. Optical component 130 is a lens, for example. In this embodiment,optical component 130 is a collimator lens. In this embodiment, opticalcomponent 130 is a plano-convex lens with one flat surface, but may be abiconvex lens or a concave lens. As long as having light transmittancethat transmits laser light 210 and capable of controlling thedistribution of laser light 210, the shape of the optical component isnot particularly limited. The material employed for optical component130 may be a glass material or a resin material, for example, and may beselected freely. In addition, optical component 130 may be fixed to case140 while being located in a lens holder, for example.

Case 140 is a housing that houses semiconductor laser element 110 andoptical component 130. The shape of case 140 is not particularly limitedbut is a cuboid or a cylinder, for example. Case 140 includes, on itssurface opposed to semiconductor laser element 110 (i.e., the surface atthe positive side of the X-axis in this embodiment) translucent window230 that transmits laser light 210. Translucent window 230 is atranslucent member that transmits laser light 210. The translucentwindow is, for example, fitted into a through-hole in case 140 and fixedto case 140. The material employed for case 140 is not particularlylimited but is metal, for example.

Case 140 includes introduction port 141 for introducing gas into case140, and exhaust port 142 for exhausting the gas inside case 140 out ofcase 140. In this embodiment, case 140 include one introduction port 141and one exhaust port 142 but may include a plurality of introductionports 141 and a plurality of exhaust ports 142. Introduction port 141and exhaust port 142 may be located in any positions in case 140. Forexample, case 140 may include introduction port 141 at the rear of case140 (i.e., at the negative side of the X-axis in this embodiment), andexhaust port 142 at the front of case 140 (i.e., at the positive side ofthe X-axis in this embodiment). Alternatively, the case may includeintroduction port 141 at the front of case 140, and exhaust port 142 atthe rear of case 140. For example, case 140 may include introductionport 141 in an upper position of case 140 (i.e., at the positive side ofthe Z-axis in this embodiment), and exhaust port 142 in a lower positionof case 140 (i.e., at the negative side of the Z-axis in thisembodiment). Alternatively, the case may include introduction port 141in a lower position of case 140, and exhaust port 142 in an upperposition of case 140. Introduction port 141 and exhaust port 142 may belocated in the opposed surfaces of case 140.

Flow passage section (i.e., tubular body) 150 includes flow passage 152that guides the gas introduced from introduction port 141 of case 140 tosemiconductor laser element 110. More specifically, flow passage section150 includes flow passage 152 that guides the gas introduced fromintroduction port 141 of case 140 to light-emitting surface 111 ofsemiconductor laser element 110. The gas introduced from introductionport 141 passes through flow passage 152 inside tubular body 150 and issprayed out of spray port 151 onto light-emitting surface 111. Sprayport 151 is placed in tubular body 150 to spray the gas onlight-emitting surface 111 of semiconductor laser element 110. In thisembodiment, flow passage section (i.e., tubular body) 150 included inoptical apparatus 100 includes spray port 151. As shown in FIGS. 1B and1C, spray port 151 is interposed between semiconductor laser element 110and optical component 130 when viewed in the direction parallel tolight-emitting surface 111, for example. For example, the gas is emittedfrom spray port 151 in the direction orthogonal to light-emittingsurface 111.

Tubular body 150 includes flow passage 152 that connects introductionport 141 and spray port 151 together and allows the gas to pass.Specifically, tubular body 150 includes spray port 151 and is connectedto introduction port 141. More specifically, tubular body 150 has oneend connected to gas supply device 190 that supplies the gas. The gassupplied from gas supply device 190 passes through introduction port 141and flow passage 152 and is exhausted from spray port 151 located at theother end of tubular body 150. Accordingly, the gas is sprayed onlight-emitting surface 111 of semiconductor laser element 110. In thisembodiment, tubular body 150 extends from introduction port 141 at thenegative side of the X-axis in case 140 toward the positive side of theX-axis over light-emitting surface 111. The tubular body bends towardlight-emitting surface Ill toward the negative sides of the X- andZ-axes.

In order to introduce the gas into case 140, gas supply device 190supplies the gas via introduction port 141, specifically, introductionport 141 and flow passage 152 of tubular body 150 to spray port 151. Forexample, gas supply device 190 is a pump that supplies the gas.

Note that spray port 151 may be directly formed in case 140. In thiscase, introduction port 141 and spray port 151 may be identical.

Tubular body 150 may be integral with case 140 or separate from case140.

Optical Characteristics

Now, optical characteristics of optical apparatus 100 will be describedtogether with comparative examples.

FIG. 2 is a graph showing a change in the optical characteristics ofoptical apparatus 100 according to Embodiment 1. Specifically, the graphshown in FIG. 2 shows an example change in optical output over time. InFIG. 2, a solid line represents an experiment result of the opticalcharacteristics of optical apparatus 100 according to Embodiment 1. Abroken line represents an experiment result of a comparative examplewhere no gas is sprayed on light-emitting surface 111 and case 140 issealed airtight by dry air. A two-dot chain line represents anexperiment result of another comparative example where case 140 is notsealed airtight and no gas is sprayed on light-emitting surface 111.Note that the dry air, which is the gas used in optical apparatus 100indicated by the solid line in the graph of FIG. 2, is the atmosphereafter extracting moisture in the air, that is, the gas containing N₂ andO₂. Note that the experiment results are represented by valuesstandardized by the optical output at the elapsed time 0.

It is found from the results shown in FIG. 2 that optical apparatus 100exhibits optical characteristics the same or similar to those in thecomparative examples sealed airtight, without sealing airtight. This maybecause the gas is sprayed on light-emitting surface 111 of opticalapparatus 100 with no dust adhering so that the facet remains clean. Thegas sprayed on light-emitting surface 111 may contain at least one ofnitrogen, hydrogen, helium, argon, halogen-based gas, or halogencompound gas in addition to oxygen.

Advantageous Effects

As described above, optical apparatus 100 according to Embodiment 1includes semiconductor laser element 110, optical component 130, case140, and flow passage section (i.e., tubular body) 150. Semiconductorlaser element 110 emits laser light 210. Optical component 130 isopposed to and spaced apart from light-emitting surface 111 throughwhich laser light 210 is emitted. Case 140 houses semiconductor laserelement 110 and optical component 130, and includes introduction port141 for introducing gas and exhaust port 142 for exhausting the gas.Flow passage section (i.e., tubular body) 150 includes spray port 151for spraying the gas introduced from introduction port 141 onsemiconductor laser element 110. More specifically, flow passage section150 includes spray port 151 for spraying the gas introduced fromintroduction port 141 on light-emitting surface 111 of semiconductorlaser element 110.

The constituent elements, such as optical device 220 or opticalcomponent 130, of optical apparatus 100 may be fixed to case 140 by aresin material, such as a silicone resin, containing Si. Ifsemiconductor laser element 110 emits laser light 210, such as blue orpurple light, with a smaller wavelength; substances, such as siloxane,containing Si vaporized inside case 140 may react with laser light 210and be then solidified. These substances adhering as dust or dirt ontolight-emitting surface 111 degrade the optical characteristics ofsemiconductor laser element 110. Tb address the problem, opticalapparatus 100 includes spray port 151 for spraying gas on light-emittingsurface 111.

Assume that semiconductor laser element 110 and optical component 130are close to each other at a distance of about 30 μm to about 200 μminside case 140, for example. The configuration described above directlyor indirectly sprays the gas on the facet of semiconductor laser element110, that is, light-emitting surface 111. For example, the gas sprayedon semiconductor laser element 110 flows around to light-emittingsurface 111. This reduces adhesion of dust or dirt onto the facet ofsemiconductor laser element 110, that is, light-emitting surface 111.Accordingly, the optical characteristics of semiconductor laser element110, specifically, the optical output over time shown in FIG. 2 is lessdegraded. The gas sprayed on semiconductor laser element 110 reduces arise in the temperature of semiconductor laser element 110, that is,reduces the temperature of semiconductor laser element 110. Accordingly,semiconductor laser element 110 has less changed optical characteristicssuch as a stable optical output.

For example, flow passage section 150 includes spray port 151 forspraying light-emitting surface 111 of semiconductor laser element 110with the gas introduced from introduction port 141. The spray portdirectly sprays the gas on the facet of semiconductor laser element 110,that is, light-emitting surface 111, if semiconductor laser element 110and optical component 130 are close to each other at a distance of about30 μm to about 200 μm inside case 140. Accordingly, the adhesion of dustor dirt onto the facet of semiconductor laser element 110, that is,light-emitting surface 111 is further reduced. As a result, the opticalcharacteristics of semiconductor laser element 110, specifically, theoptical output over time shown in FIG. 2 is less degraded.

For example, when viewed in the direction parallel to light-emittingsurface 111, spray port 151 is interposed between semiconductor laserelement 110 and optical component 130.

This configuration allows effective spraying of the gas onlight-emitting surface 111 of semiconductor laser element 110.Accordingly, the adhesion of dust or dirt onto light-emitting surface111 of semiconductor laser element 110 is reduced.

For example, tubular body 150 includes flow passage 152 that connectsintroduction port 141 and spray port 151 together and allows the gas topass.

This configuration effectively guides the gas introduced fromintroduction port 141 to light-emitting surface 111 of semiconductorlaser element 110. Accordingly, the adhesion of dust or dirt on tolight-emitting surface 111 of semiconductor laser element 110 is furtherreduced.

For example, the gas sprayed on light-emitting surface 111 ofsemiconductor laser element 110 contains oxygen.

This reduces degradation in the optical output of optical apparatus 100over time.

For example, the gas sprayed on light-emitting surface 111 ofsemiconductor laser element 110 contains at least one of nitrogen,hydrogen, helium, argon, halogen-based gas, or halogen compound gas inaddition to oxygen.

Employment of these inert gases in addition to oxygen reduce degradationin the optical output of optical apparatus 100 over time. These gaseshave high thermal conductivities. The employment of gas with a highthermal conductivity reduces adhesion of dust or dirt ontolight-emitting surface 111 of semiconductor laser element 110 and easilyreleases the heat generated in semiconductor laser element 110 fromsemiconductor laser element 110.

Variation 1

FIG. 3A is a partial side view showing optical apparatus 100 a accordingto Variation 1 of Embodiment 1. FIG. 3B is a partial front view showingoptical apparatus 100 a according to Variation 1 of Embodiment 1. Notethat FIGS. 3A and 3B show the constituent elements corresponding tothose in FIGS. 1C and 1D and does not show some of the constituentelements such as case 140.

As shown in FIGS. 3A and 3B, spray port 151 is located in a lowerposition in optical apparatus 100 a. In this manner, spray port 151 maybe located in any position as long as capable of spraying the gas onlight-emitting surface 111.

Variation 2 FIG. 4A is a partial side view showing optical apparatus 100b according to Variation 2 of Embodiment 1. FIG. 4B is a partial frontview showing optical apparatus 100 b according to Variation 2 ofEmbodiment 1. Note that FIGS. 4A and 4B show the constituent elementscorresponding to those in FIGS. 1C and 1D and does not show some of theconstituent elements such as case 140.

As shown in FIGS. 4A and 4B, optical apparatus 100 b includes aplurality of spray ports 151. For example, optical apparatus 100 bincludes a plurality of tubular bodies 150 each including spray port151. In this manner, optical apparatus 100 b may include the pluralityof spray ports 151.

Variation 3

FIG. 5A is a partial side view showing optical apparatus 100 c accordingto Variation 3 of Embodiment 1. FIG. 5B is a partial front view showingthe optical apparatus according to Variation 3 of Embodiment 1. Notethat FIGS. 5A and 5B show the constituent elements corresponding tothose in FIGS. 1C and 1D and does not show some of the constituentelements such as case 140.

As shown in FIGS. 5A and 5B, spray port 151 is located in a lowerposition in optical apparatus 100 c. Optical apparatus 100 c includes aplurality of spray ports 151. For example, optical apparatus 100 cincludes a plurality of tubular bodies (not shown) each including sprayport 151. In this manner, the configurations shown in the embodiment andvariations may be combined freely.

Variation 4 FIG. 6 is a top view showing an internal configuration of anoptical apparatus according to Variation 4 of Embodiment 1. Note thatFIG. 6 is a top view corresponding to FIG. 1A.

As shown in FIG. 6, tubular body 150 included in optical apparatus 100 dextends to pass not above optical device 220 but through a side of theoptical device (i.e., in direction along the Y-axis in this embodiment).In optical apparatus 100 d, spray port 151 is located on the side. Inthis manner, the position and orientation of tubular body 150 in case140 may be determined freely.

Variation 5

FIG. 7 is a top view showing an internal configuration of an opticalapparatus according to Variation 5 of Embodiment 1. Note that FIG. 7 isa top view corresponding to FIG. 1A.

As shown in FIG. 7, tubular body 150 a included in optical apparatus 100e includes two spray ports 151. Specifically, tubular body 150 a has oneend connected to gas supply device 190, branches off from gas supplydevice 190 into two, and extends not above optical device 220 butthrough respective sides of optical device 220. In this manner, tubularbody 150 a may include the plurality of spray ports 151.

This configuration allows direct spraying of the gas on a wider area oflight-emitting surface 111 of semiconductor laser element 110.Accordingly, the adhesion of dust or dirt onto light-emitting surface111 of semiconductor laser element 110 is reduced. In particular, ifsemiconductor laser element 110 is a multi-emitter including a pluralityof luminous points, a plurality of spray ports 151 are provided to spraythe gas on the plurality of luminous points. For example, even ifsemiconductor laser element 110 is a multi-emitter, the adhesion of dustor dirt onto the plurality of luminous points can be reduced.

Note that the positions of the plurality of spray ports 151 inside case140 may be determined freely.

Embodiment 2

Now, an optical apparatus according to Embodiment 2 will be describedwith reference to FIGS. 8 and 9.

In the description of the optical apparatus according to Embodiment 2,substantially the same reference characters as those of opticalapparatus 100 according to Embodiment 1 are used to represent equivalentelements, and the redundant explanation thereof may be omitted orsimplified.

Configuration

FIG. 8 is a top view showing an internal configuration of opticalapparatus 101 according to Embodiment 2 Note that FIG. 8 is a top viewcorresponding to FIG. 1A.

Optical apparatus 101 is a laser module that emits laser light 210.Optical apparatus 101 is used as a laser source for a processing devicefor laser processing, for example. In this embodiment, optical apparatus101 is what is called a “CAN package” laser diode module.

Optical apparatus 101 includes a plurality of optical devices 220, aplurality of optical components 130, optical component 131, case 140,and tubular body 150 b with a plurality of spray ports 151. Opticalapparatus 101 according to Embodiment 2 is different from opticalapparatus 100 according to Embodiment 1 in the following. The systemincludes the plurality of optical devices 220, that is, the plurality ofsemiconductor laser elements 110. Optical components 130 and spray ports151 are provided corresponding to the plurality of semiconductor laserelements 110.

The plurality of optical components 130 are in one-to-one correspondenceto the plurality of optical devices 220, specifically, the plurality ofsemiconductor laser elements 110 and, in case 140, opposed to and spacedapart from light-emitting surfaces 111.

The plurality of spray ports 151 are in one-to-one correspondence to theplurality of optical devices 220, specifically, the plurality ofsemiconductor laser elements 110, and located in tubular body 150 b tospray the gas on light-emitting surfaces 111. That is, tubular body 150b includes the plurality of spray ports 151. In addition, the pluralityof spray ports 151 are arranged in one-to-one correspondence to theplurality of semiconductor laser elements 110. In this embodiment, onetubular body 150 b included in optical apparatus 101 includes sprayports 151.

Tubular body 150 b includes, inside, a flow passage that connectsintroduction port 141 and the plurality of spray ports 151 together andallows the gas to pass. Specifically, tubular body 150 b includes theplurality of spray ports 151 and a part of tubular body 150 b is locatedin introduction port 141. Tubular body 150 b has one end connected togas supply device 190 that supplies gas. The gas supplied from gassupply device 190 passes through the flow passage inside tubular body150 b and is exhausted from the plurality of spray ports 151 located atthe other ends of tubular body 150 b. Accordingly, the gas is sprayed onlight-emitting surfaces 111 of respective semiconductor laser elements110 included in the plurality of optical devices 220.

Tubular body 150 b has one end connected to gas supply device 190,branches off from gas supply device 190 into the number of opticaldevices 220, and extends. The branches extend to pass through the sidesof optical devices 220.

Note that optical apparatus 101 may include one tubular body 150 bincluding the plurality of spray ports 151. For example, like opticalapparatus 100 c shown in FIGS. 5A and 5B, the plurality of tubularbodies 150 may be included and the gas may be sprayed out of respectivespray ports 151 of tubular bodies 150 onto light-emitting surfaces 111of semiconductor laser elements 110 included in optical devices 220.

Optical component 131 is a lens that collects laser light 210 that haspassed through the plurality of optical components 130 and emitscollected laser light 210 a toward translucent window 230. Note thatoptical component 131 is a plano-convex lens with one flat surface, butmay be a biconvex lens or a concave lens. As long as having lighttransmittance that transmits laser light 210 a and capable ofcontrolling the distribution of laser light 210 a, the shape of theoptical component is not particularly limited. The material employed foroptical component 131 may be a glass material or a resin material, forexample, and may be selected freely. In addition, optical component 131may be fixed to case 140 while being located in a lens holder, forexample.

Advantageous Effects

As described above, optical apparatus 101 according to Embodiment 2includes the plurality of semiconductor laser element 110 and theplurality of spray ports 151 arranged in one-to-one correspondence tothe plurality of semiconductor laser elements 110.

This configuration allows spraying of the gas on respectivelight-emitting surfaces 111 of the plurality of semiconductor laserelements 110. Accordingly, if the plurality of semiconductor laserelements 110 are included as in optical apparatus 101, the adhesion ofdust or dirt onto respective light-emitting surfaces 111 of theplurality of semiconductor laser elements 110 can be reduced.

Variation

FIG. 9 is a partial top view showing an internal configuration ofoptical apparatus 101 a according to a variation of Embodiment 2. Notethat FIG. 9 is a top view corresponding to FIG. 1A.

Like optical apparatus 101, optical apparatus 101 a includes a pluralityof optical devices 220, a plurality of optical components 130, opticalcomponent 131, case 140, and a plurality of spray ports 151. Likeoptical apparatus 101, optical apparatus 101 a includes the plurality ofoptical devices 220, that is, the plurality of semiconductor laserelements 110 (see e.g., FIG. 1B). Optical components 130 and spray ports151 are provided corresponding to the plurality of semiconductor laserelements 110.

The plurality of spray ports 151 are holes in one-to-one correspondencethe plurality of optical devices 220, specifically, the plurality ofsemiconductor laser elements 110 to spray the gas on light-emittingsurfaces 111. That is, the plurality of spray ports 151 are arranged inone-to-one correspondence to the plurality of semiconductor laserelements 110 a. In this variation, one tubular body 150 c included inoptical apparatus 101 a includes the plurality of spray ports 151.

Tubular body 150 c includes, inside, a flow passage that connectsintroduction port 141 and the plurality of spray ports 151 together andallows the gas to pass. Specifically, tubular body 150 c includes theplurality of spray ports 151, and a part of tubular body 150 c islocated in introduction port 141. Tubular body 150 c has one endconnected to gas supply device 190 that supplies the gas. The gassupplied from gas supply device 190 passes through the flow passageinside tubular body 150 c and is exhausted from the plurality of sprayports 151 located at the other ends of tubular body 150 c. Accordingly,the gas is sprayed on light-emitting surfaces 111 of semiconductor laserelements 110 included in the plurality of optical devices 220.

Tubular body 150 c has one end connected to gas supply device 190,branches off from gas supply device 190 into the number of opticaldevices 220, and extends. The branches extend to pass above opticaldevices 220. This configuration also allows spraying of the gas onrespective light-emitting surfaces 111 of the plurality of semiconductorlaser elements 110.

Embodiment 3

Now, an optical apparatus according to Embodiment 3 will be describedwith reference to FIG. 10.

In the description of the optical apparatus according to Embodiment 3,substantially the same reference characters as those of opticalapparatus 100 according to Embodiment 1 are used to represent equivalentelements, and the redundant explanation thereof may be omitted orsimplified.

Configuration

FIG. 10 is a partial top view showing an internal configuration ofoptical apparatus 102 according to Embodiment 3.

Optical apparatus 102 includes optical device 220, optical component130, case 140, and tubular body 150 with spray port 151. Opticalapparatus 102 also includes circulation device 180.

Circulation device 180 is connected to introduction port 141 and exhaustport 142 outside case 140, and circulates the gas inside case 140 byexhausting the gas from exhaust port 142 and introducing, fromintroduction port 141, the gas exhausted from exhaust port 142.Circulation device 180 includes gas supply device 180 a, tubular body180 b, and tubular body 180 c, for example.

Gas supply device 180 a supplies the gas supplied from tubular body 180c to tubular body 180 b to calculate the gas inside case 140. Gas supplydevice 180 a includes a pump for circulating the gas, and a filter forremoving dust in the gas, for example.

Tubular body 180 b includes, inside, a flow passage through which thegas passes, and has one end connected to gas supply device 180 a and theother end connected to introduction port 141. In this embodiment,tubular body 180 b extends from introduction port 141 and is connectedto spray port 151.

Tubular body 180 c includes, inside, the flow passage through which thegas passes, and has one end connected to exhaust port 142 of case 140and the other end connected to gas supply device 180 a.

Advantageous Effects

As described above, optical apparatus 102 according to Embodiment 3includes semiconductor laser element 110, optical component 130, case140, and flow passage section 150. The optical apparatus furtherincludes circulation device 180 that is connected to introduction port141 and exhaust port 142 outside case 140 and circulates the gas insidecase 140 by exhausting the gas from exhaust port 142 and introducing,from introduction port 141, the gas exhausted from exhaust port 142.

This configuration allows direct spraying of the gas on light-emittingsurface 111 of semiconductor laser element 110. This reduces adhesion ofdust or dirt onto light-emitting surface 111 of semiconductor laserelement 110. If the gas inside case 140 circulated and used to adjustthe concentrations of the components, such as oxygen, in the gas, forexample, the concentrations of the components in the gas are adjustedonce to continuously spray the gas with the adjusted concentrations onlight-emitting surface 111.

Embodiment 4

Now, an optical apparatus according to Embodiment 4 will be describedwith reference to FIGS. 11A to 14B.

In the description of the optical apparatus according to Embodiment 4,substantially the same reference characters as those of opticalapparatus 100 according to Embodiment 1 are used to represent equivalentelements, and the redundant explanation thereof may be omitted orsimplified.

Configuration

FIG. 11A is a partial side view showing optical apparatus 103 accordingto Embodiment 4. FIG. 11B is a partial perspective view showing opticalapparatus 103 according to Embodiment 4.

Note that FIG. 11A shows the constituent elements corresponding to thosein FIG. 1C and does not show some of the constituent elements such ascase 140. FIG. 11B does not show some of the constituent elements suchas case 140, either.

Optical apparatus 103 is a laser module that emits laser light 210.Optical apparatus 100 is used as a laser source for a processing devicefor laser processing, for example. In this embodiment, optical apparatus103 is what is called a “CAN package” laser diode module.

Optical apparatus 103 includes optical device 220, optical component130, case 140, and a plurality of tubular bodies 150 each includingspray port 151. Although not shown in the figure, like optical apparatus100, optical apparatus 103 includes case 140 (see e.g., FIG. 1A) thathouses optical device 220 and optical component 130, and gas supplydevice 190 that supplies the gas to tubular bodies 150.

Optical component 130 included in optical apparatus 103 is fixed tosupport member 160 by fixing member 170.

Fixing member 170 fixes optical component 130 to support member 160.Fixing member 170 is made of a resin material, for example.

Fixing member 170 has through-holes 171, for example.

The gas sprayed out of spray ports 151 passes through through-holes 171.Through-holes 171 are interposed between light-emitting surface 111 ofsemiconductor laser element 110 and spray ports 151.

Note that FIG. 11B illustrates optical apparatus 103 that includes aplurality of tubular bodies 150, that is, a plurality of spray ports 151and fixing member 170 having a plurality of through-holes 171corresponding to the plurality of spray ports 151. Optical apparatus 103may include one tubular body 150, that is, one spray port 151, andfixing member 170 with one through-bole.

The shape, size, and number of through-holes 171 are not particularlylimited. For example, optical apparatus 103 may include a plurality oftubular bodies 150, that is, a plurality of spray ports 151 and fixingmember 170 including one through-hole 171 that is long in a top view andcorresponds to the plurality of spray ports 151.

Through-hole 171 and tubular body 150 may be connected together. In thiscase, an opening of through-hole 171 at light-emitting surface 111 mayserve as spray port 151.

Advantageous Effects

As described above, optical apparatus 103 according to Embodiment 4includes semiconductor laser element 110, optical component 130, case140, and flow passage sections 150. The optical apparatus furtherincludes support member 160 and fixing member 170. Support member 160 isinterposed between semiconductor laser element 110 and case 140 andsupports semiconductor laser element 110. Fixing member 170 fixesoptical component 130 to support member 160.

This configuration reduces changed in the relative positionalrelationship between semiconductor laser element 110 and opticalcomponent 130 as compared to the case where optical device 220 includingsemiconductor laser element 110 and optical component 130 are located incase 140, for example. Accordingly, optical apparatus 103 is easilymanufactured which emits laser light 210 with desired distributioncharacteristics.

For example, fixing member 170 has through-holes 171 through which thegas sprayed out of spray ports 151 passes. Through-holes 171 areinterposed between light-emitting surface 111 and spray ports 151.

This configuration allows the gas to pass through-holes 171 and directspraying of the gas on light-emitting surface 111 of semiconductor laserelement 110, wherever spray ports 151 and fixing member 170 arearranged. This reduces adhesion of dust or dirt onto the facet ofsemiconductor laser element 110, that is, light-emitting surface 111.Accordingly, degradation in the optical characteristics of semiconductorlaser element 110, specifically, degradation in the optical output overtime shown in FIG. 2 is reduced.

Variation 1

FIG. 12A is a partial side view showing optical apparatus 103 aaccording to Variation 1 of Embodiment 4. FIG. 12B is a partialperspective view showing optical apparatus 103 a according to Variation1 of Embodiment 4.

Note that FIG. 12A shows the constituent elements corresponding to thosein FIG. 1C and does not show some of the constituent elements such ascase 140. FIG. 12B does not show some of the constituent elements suchas case 140, either.

Optical apparatus 103 a includes optical device 220, optical component130, case 140, and tubular body 150 with spray port 151. Although notshown in the figure, like optical apparatus 100, optical apparatus 103 aincludes case 140 (see e.g., FIG. 1A) housing optical device 220 andoptical component 130, and gas supply device 190 that supplies the gasto tubular body 150.

Optical component 130 included in optical apparatus 103 a is fixed tosupport member 160 by fixing member 170 a.

Fixing member 170 a fixes optical component 130 to support member 160.Fixing member 170 a is made of a resin material, for example.

Unlike fixing member 170, fixing member 170 a has no through-hole. Sprayport 151 is located on a side of semiconductor laser element 110 tospray the gas on light-emitting surface 111 of semiconductor laserelement 110 from the side. This configuration allows spraying of the gason light-emitting surface 111 of semiconductor laser element 110, evenif fixing member 170 has no through-hole.

Variation 2

FIG. 13A is a partial side view showing optical apparatus 103 baccording to Variation 2 of Embodiment 4. FIG. 13B is a partialperspective view showing optical apparatus 103 b according to Variation2 of Embodiment 4.

Note that FIG. 13A shows the constituent elements corresponding to thosein FIG. 1C and does not show some of the constituent elements such ascase 140. FIG. 13B does not show some of the constituent elements suchas case 140, either.

Optical apparatus 103 b includes optical device 220, optical component130, case 140, and tubular body 150 with spray port 151. Although notshown in the figure, like optical apparatus 100, optical apparatus 103 bincludes case 140 (see e.g., FIG. 1A) housing optical device 220 andoptical component 130, and gas supply device 190 (see e.g., FIG. 1A)that supplies the gas to tubular body 150.

Optical component 130 included in optical apparatus 103 b is fixed tosupport member 161 by fixing member 170 b. In this manner, opticalcomponent 130 may be fixed to any of support member 160 and supportmember 161. Needless to mention, optical component 130 may be fixed toboth of support member 160 and support member 161.

Fixing member 170 b fixes optical component 130 to support member 161.Fixing member 170 b is made of a resin material, for example.

Unlike fixing member 170, fixing member 170 b has no through-hole. Sprayport 151 is located on a side of semiconductor laser element 110 tospray the gas on light-emitting surface 111 of semiconductor laserelement 110 from the side. This configuration allows spraying of the gason light-emitting surface 111 of semiconductor laser element 110, evenif fixing member 170 b has no through-hole.

Variation 3

FIG. 14A is a partial side view showing optical apparatus 103 caccording to Variation 3 of Embodiment 4. FIG. 14B is a partialperspective view showing optical apparatus 103 c according to Variation3 of Embodiment 4.

Note that FIG. 14A shows the constituent elements corresponding to thosein FIG. 1C and does not show some of the constituent elements such ascase 140. FIG. 14B does not show some of the constituent elements suchas case 140, either.

Optical apparatus 103 c includes optical device 220, optical component130, case 140, and tubular body 150 with spray port 151. Although notshown in the figure, like optical apparatus 100, optical apparatus 103 cincludes case 140 (see e.g., FIG. 1A) housing optical device 220 andoptical component 130, and gas supply device 190 (see e.g., FIG. 1A)that supplies the gas to tubular body 150.

Optical component 130 included in optical apparatus 103 c is fixed tosupport member 160 by two fixing members 170 c. In this manner, opticalcomponent 130 may be fixed by a plurality of fixing members 170 c.

Two fixing members 170 c are spaced apart from each other. Thisconfiguration allows spraying of the gas on light-emitting surface 111via through-hole 171 a that is the gap between two fixing members 170 c.Fixing member 170 c is made of a resin material, for example.

OTHER EMBODIMENTS

While the optical apparatus according to one or more aspects has beendescribed above based on the embodiments, the present disclosure is notlimited to the embodiments. One or more aspects may include otherembodiments, such as those obtained by variously modifying theembodiments as conceived by those skilled in the art or those achievedby freely combining the constituent elements in the embodiments withoutdeparting from the scope and spirit of the present disclosure.

For example, while an example has been described above in theembodiments where the flow passage section with the spray port(s) is atubular body, the shape of the flow passage section is not particularlylimited. For example, the flow passage section may be obtained bycombining one or more plate members formed inside the case. The flowpassage section is not necessarily in the tubular shape but may be in agutter-shape or in any shape as long as capable of guiding the gas fromthe introduction port of the case to the light-emitting surface of thesemiconductor laser element.

For example, in the embodiments described above, the light-emittingsurface is the light-emitting surface of the semiconductor laserelement. For example, if a transparent member that transmits laser lightis further interposed between the semiconductor laser element and theoptical component, the light-emitting surface may be the surface of thetransparent member facing the optical component.

INDUSTRIAL APPLICABILITY

The optical apparatus according to the present disclosure is utilized asa laser source used in laser processing, for example.

The invention claimed is:
 1. An optical apparatus, comprising: asemiconductor laser element that emits laser light; an optical componentopposed to and spaced apart from a light-emitting surface through whichthe laser light is emitted; a case that houses the semiconductor laserelement and the optical component, and includes an introduction port forintroducing gas and an exhaust port for exhausting the gas; and a flowpassage section including a spray port for spraying the semiconductorlaser element with the gas introduced from the introduction port,wherein the flow passage section includes the spray port for sprayingthe light-emitting surface with the gas introduced from the introductionport.
 2. The optical apparatus according to claim 1, wherein as viewedin a direction parallel to the light-emitting surface, the spray port isinterposed between the semiconductor laser element and the opticalcomponent.
 3. The optical apparatus according to claim 1, wherein theflow passage section is a tubular body that connects the introductionport and the spray port together and includes a flow passage throughwhich the gas passes.
 4. The optical apparatus according to claim 1,further comprising: a support member that is interposed between thesemiconductor laser element and the case and supports the semiconductorlaser element; and a fixing member that fixes the optical component tothe support member.
 5. The optical apparatus according to claim 4,wherein the fixing member includes a through-hole through which the gassprayed out of the spray port passes, and the through-hole is interposedbetween the light-emitting surface and the spray port.
 6. The opticalapparatus according to claim 1, further comprising: a circulation devicethat is connected to the introduction port and the exhaust port outsidethe case, and circulates the gas inside the case by exhausting the gasfrom the exhaust port and introducing, from the introduction port, thegas exhausted from the exhaust port.
 7. An optical apparatus,comprising: a semiconductor laser element that emits laser light; anoptical component opposed to and spaced apart from a light-emittingsurface through which the laser light is emitted; a case that houses thesemiconductor laser element and the optical component, and includes anintroduction port for introducing gas and an exhaust port for exhaustingthe gas; and a flow passage section including a plurality of spray portsfor spraying the semiconductor laser element with the gas introducedfrom the introduction port, each of the-plurality of spray ports spraysthe semiconductor laser element with the gas.
 8. The optical apparatusaccording to claim 7, further comprising: a plurality of semiconductorlaser elements each being the semiconductor laser element, wherein theplurality of spray ports are arranged in a one-to-one correspondence tothe plurality of semiconductor laser elements.
 9. An optical apparatus,comprising: a semiconductor laser element that emits laser light; anoptical component opposed to and spaced apart from a light-emittingsurface through which the laser light is emitted; a case that houses thesemiconductor laser element and the optical component, and includes anintroduction port for introducing gas and an exhaust port for exhaustingthe gas; and a flow passage section including a spray port for sprayingthe semiconductor laser element with the gas introduced from theintroduction port, wherein the gas contains oxygen.
 10. The opticalapparatus according to claim 9, wherein the gas further contains atleast one of nitrogen, hydrogen, helium, argon, halogen-based gas, orhalogen compound gas.